SMD291-5M

No-clean tack flux, used for touch up and rework, attachment of BGA spheres, soldering flip chip components.

• Ideal for all rework, solder, de-solder, and reflow applications
• Non-corrosive, non-conductive, no-clean
• Tack flux will not run all over PCB when applied
• Has a pleasant odour
• Excellent wetting
• Easily cleaned with isopropyl alcohol (IPA)
• Attachment of BGA spheres
• Soldering flip chip components
• Long stencil life
• Wide process window
• Clear residue
• Can be used with leaded and lead-free applications