NC191

A lower density flux vehicle for better shear spread and improved flow during heating.

• Ideal for all rework, solder, de-solder and reflow applications
• Non-corrosive, non-conductive, no-clean
• Tack flux will not run all over PCB when applied
• Excellent wetting
• Easily cleaned with isopropyl alcohol (IPA)
• Attachment of BGA spheres
• Soldering flip chip components
• Long stencil life, Wide process window
• Halogen Free (EN14582 test method)
• Clear residue
• Can be used with leaded and lead-free applications
• Volume: 10cc