TLF6000HG00-00-150CC

TLF6000HG00-00-150CC is a thermally conductive, one-part, liquid formable gel material designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal reliability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable vertical gap stability is required. It is most effective for gaps as narrow as </= 3mm. It is pre-cured, requiring no mixing or refrigeration.

• Thermal conductivity of 6.0W/m-K
• Dispensable pre-cured gel
• Stable viscosity in storage and in the application
• Excellent chemical stability and mechanical stability