D-FAR-0045

Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present.

• Eliminates air gaps to reduce thermal resistance
• Highly conformable to reduce interfacial resisitance
• Low-stress vibration dampening
• Compatible with automated dispensing equipment
• Adhesive backed
• Supplied in a 100 x 100mm sheet