Figure 3. Block diagram of the buck converter (Figure 3a) and the general switching waveforms of the converter (Figure 3b).
Buck converter block and typical switching waveforms used to illustrate loss components.
As shown in Figure 3(b), power device losses in a converter consist of switching losses, conduction losses, body diode losses, recovery losses, and Coss losses. (Coss loss is omitted from the figure because it is small.)
As for switching loss, it is generally described in the datasheet as energy per Eon and Eoff pulse, which is a useful for loss estimation in the initial design stage. In detailed design, it is necessary to strictly determine the power dissipation at high voltage input and high frequency. The gate driving circuitry has a large impact in the device losses, so optimizing the gate drive design is necessary to take advantage of the high-speed switching characteristics of SiC devices.
Design notes
- Gate drive: set Rg to balance EMI and switching speed; validate with a double-pulse test.
- Layout: minimise loop inductance; keep high di/dt paths tight; use Kelvin source when available.
- Thermal: size the heatsink for worst-case operation and monitor junction temperature.
Experimental Verification of DC-DC Converter
In order to confirm previous analysis, the 4th Generation SiC MOSFETs was incorporated into a step-down DC-DC converter with the following specifications and verified it experimentally with an evaluation board (table 1).
Figure 4 shows (a) the DC-DC converter circuit and (b) the evaluation board for the 4th Generation SiC MOSFETs used in the half-bridge section with built-in decoupling capacitor. The inductor L, output capacitor Co, and input bulk capacitor are external.
Table 1. Specifications of DC-DC Converters and SiC Device
| Vin | 500V |
| Vo | 250V |
| Po | 7kW |
| fsw | 50kHz |
| L | 500uH |
| Rg_ext | 3.3ohm |
| 4th generation SiC MOSFETs | SCT4036KR 1200V/36mΩ |
| 3rd generation SiC MOSFETs (as a reference) | SCT3040KR 1200V/40mΩ |