MEGACAP CA Series Stacked Multilayer Ceramic Capacitors:

The MEGACAP Type MLCCs feature metal lead frames attached to the electrode ends of the components to protect against board flexure cracks and solder cracks from thermal shocks. The metal material of the terminal has also been optimized to lower the ESR and achieve a higher ripple current capability. In order to enable a low profile with increased capacitance, TDK has adapted its MEGACAP stack design so that the MLCC elements are stacked side by side. The vertically stacked design enables stacks with three or even more elements.

• Unique structure achieves high capacitance, high reliability and low resistance.
• Metal frame relieves mechanical stress and thermal shock.
• Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces.
• High reliability qualified based on AEC-Q200